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Old 06-24-2010, 11:33 PM   #1
BigE4u
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How Thermal Compound Spreads

Neat video utilizing a flat piece of plexyglass to simulate how TIM theoreticaly spreads between the CPU and HSF. enjoy

http://www.youtube.com/watch?v=EyXLu...eature=related
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Old 06-24-2010, 11:49 PM   #2
boots
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That's a good video. I'm fixin to upgrade my stock HS&F to an H-50. from what I've read isn't it better to spread the TIM with something before you apply your heatsink?
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Old 06-25-2010, 12:26 AM   #3
Sephious
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Quote:
Originally Posted by boots View Post
That's a good video. I'm fixin to upgrade my stock HS&F to an H-50. from what I've read isn't it better to spread the TIM with something before you apply your heatsink?
This was thought for awhile, but then you get air bubbles trapped in between and get worse heat transfer.
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Old 06-25-2010, 12:58 AM   #4
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Interesting. It would be interesting to see the effect with a simulated mount (backplate, springs, nuts and bolts) with an applied heating and cooling cycle.
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Old 06-25-2010, 04:35 AM   #5
FX5200
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That vid converted me from the "spread TIM on the IHS" method, to the "grain of rice in the middle" method
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Old 06-25-2010, 06:44 AM   #6
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I have been doing the spread since I started building. I am going to switch to the X (none spread). Great find and thanks for sharing.
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Old 06-25-2010, 06:45 AM   #7
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That vid converted me from the "spread TIM on the IHS" method, to the "grain of rice in the middle" method
Yup, this method was recommended at least 5 years ago and is just now catching on with some folks ...
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Old 06-25-2010, 08:55 AM   #8
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Doesnt the chip matter also? Like AMD an Intel are different right? (concave, convex?)
also did you look at this vid? http://www.youtube.com/watch?v=ffK7L...watch_response

Last edited by IcyLynx; 06-25-2010 at 09:00 AM.
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Old 06-25-2010, 02:54 PM   #9
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Thumbs up

AS5 has been telling us this since 1864!
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Old 06-25-2010, 03:36 PM   #10
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I am guilty of the spread too thanks for the little video, im goin X method next time
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Old 06-25-2010, 03:52 PM   #11
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Cool video, didn't understand why not to spread it before.
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Old 06-25-2010, 04:02 PM   #12
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I always had faith in the cross method.
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Old 06-26-2010, 02:15 PM   #13
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Spread method here. High TDP cpu's need full coverage, This video shows P4's single and dual cores. Those are easy to cool even over clocked.

Athlon II HSF's (stock) don't cover the entire IHS plate surface area because the chip is such a low TDP (Athlon II 250 for example).

This video is old and dated and pertains to low end (current) and low end older hardware mainly.

Additional Comment:

Quote:
Originally Posted by BigE4u View Post
Neat video utilizing a flat piece of plexyglass to simulate how TIM theoreticaly spreads between the CPU and HSF. enjoy
My water block won't bend like the Plexiglas will. The test is BS imo.

Last edited by ShrimpBrime; 06-26-2010 at 02:15 PM. Reason: Automerged Doublepost
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Old 06-26-2010, 02:18 PM   #14
BigE4u
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I did meantion the word theoretical... just to give people an idea on whats happening.
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Old 06-26-2010, 02:24 PM   #15
FX5200
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Then use a LITTLE bit more TIM, to ensure full IHS coverage?
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Old 06-26-2010, 02:26 PM   #16
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What's wrong with caking it on and wiping off the excess?
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Old 06-26-2010, 02:56 PM   #17
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Looks like it is the X for me from now on, always have spread thin.
Thanks for the info.
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Old 06-26-2010, 03:03 PM   #18
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Spread method here as well... but i dont use the thicker viscosity AS3/5, i use ASCeramique.

Next time for sure, i'll try the X-MEN technique and see if it works for me while still using ASCeramique.
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Old 06-26-2010, 10:30 PM   #19
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Spread works best for me w/AS5 even with the air bubble possibility. I'll try every method with a new TIM one day.
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Old 06-26-2010, 10:32 PM   #20
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Cool just redone my cpu using the X method
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